The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2024
Filed:
Aug. 13, 2021
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Eunhee Jeang, Paju-si, KR;
Seongkeun Cho, Suwon-si, KR;
Kyungrim Kim, Anyang-si, KR;
Incheol Song, Hwaseong-si, KR;
Jangwon Cho, Suwon-si, KR;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); C23C 16/44 (2006.01); C23C 16/455 (2006.01); C23C 16/511 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32238 (2013.01); H01J 37/32229 (2013.01); H01J 37/32669 (2013.01); C23C 16/4404 (2013.01); C23C 16/45565 (2013.01); C23C 16/511 (2013.01); H01J 37/3244 (2013.01); H01J 37/3266 (2013.01); H01L 21/67069 (2013.01);
Abstract
A wafer processing apparatus includes a chamber body including a cavity region and a process region; a microwave waveguide configured to introduce a microwave into the cavity region; a first microwave window between the cavity region and the process region; and a magnetic field supplying device configured to apply a magnetic field inside the chamber body, wherein a thickness of the first microwave window is constant, and the first microwave window is configured to control a beam cross-section of the microwave in the process region.