The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2024
Filed:
Oct. 07, 2021
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Kong Joo Jeon, Suwon-si, KR;
So Jung An, Suwon-si, KR;
Kwang Yeun Won, Suwon-si, KR;
Woo Kyung Sung, Suwon-si, KR;
Kyu Sik Park, Suwon-si, KR;
Myung Jun Park, Suwon-si, KR;
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Abstract
An electronic component includes a microbody including a body including a plurality of dielectric layers and a plurality of internal electrodes disposed with a corresponding dielectric layer interposed therebetween, and an electrode layer disposed on an external side surface of the body and connected to a portion of the plurality of internal electrodes; and a sealing thin film. The microbody includes a microhole extending in at least a portion of the dielectric layer, the internal electrode, and the electrode layer through a surface of the microbody. The sealing thin film includes an internal sealing thin film disposed in at least a portion of an internal space of the open microhole to seal the microhole.