The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 28, 2024

Filed:

Aug. 24, 2021
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Daniel J. Barrett, Redwood City, CA (US);

Timothy D. Burks, Santa Cruz, CA (US);

Tyler R. Kakuda, San Francisco, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/1333 (2006.01); F21V 8/00 (2006.01); G02B 6/08 (2006.01); G02F 1/01 (2006.01); H10K 50/84 (2023.01);
U.S. Cl.
CPC ...
G02F 1/133331 (2021.01); G02B 6/0005 (2013.01); G02B 6/08 (2013.01); G02F 1/0115 (2013.01); H10K 50/84 (2023.02);
Abstract

An electronic device may have a display, a display cover layer, and an image transport layer formed from a coherent fiber bundle. The coherent fiber bundle may be placed between the display and the display cover layer. A gap may separate the coherent fiber bundle from the display cover layer. Adhesive in the gap may attach the coherent fiber bundle to the display cover layer. Molded polymer may be coupled to a bent edge of the display, a portion of the display with backside contacts, or components coupled to the backside contacts or other portions of the display. The molded polymer may support the coherent fiber bundle relative to the cover layer. The molded polymer may be molded to an inner surface of the cover layer and may be used to receive fasteners or otherwise facilitate mounting of housing structures and components in the device.


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