The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2024
Filed:
Apr. 03, 2020
Hitachi Metals, Ltd., Tokyo, JP;
Atsuro Yaguchi, Hitachi, JP;
Akinari Nakayama, Hitachinaka, JP;
PROTERIAL, LTD., Tokyo, JP;
Abstract
A method for producing a molding article includes preparing an insulated wire including an outermost layer disposed on an outer periphery of a conductor, the outermost layer including a resin composition including a fluorine-containing elastomer. The resin composition includes a tetrafluoroethylene-propylene copolymer and an ethylene-tetrafluoroethylene copolymer as an entire base polymer or a portion of the base polymer at a mass ratio of the tetrafluoroethylene-propylene copolymer to the ethylene-tetrafluoroethylene copolymer in a range of 100:0 to 60:40. The resin composition further includes 5 to 60 parts by mass of calcium carbonate and/or silica as an inorganic filler with respect to 100 parts by mass of the base polymer.