The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 28, 2024

Filed:

Oct. 26, 2018
Applicant:

National Research Council of Canada, Ottawa, CA;

Inventors:

Chantal Paquet, Ottawa, CA;

Jacques Lefebvre, Stoneham-et-Tewkesbury, CA;

Jingwen Guan, Ottawa, CA;

Patrick Roland Lucien Malenfant, Orleans, CA;

Benoit Simard, Ottawa, CA;

Yadienka Martinez-Rubi, Ottawa, CA;

Arnold Kell, Orleans, CA;

Xiangyang Liu, Nepean, CA;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09C 3/10 (2006.01); B41M 3/00 (2006.01); B41M 7/00 (2006.01); C09D 11/037 (2014.01); C09D 11/322 (2014.01); C09D 11/52 (2014.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 3/12 (2006.01);
U.S. Cl.
CPC ...
C09C 3/10 (2013.01); B41M 3/006 (2013.01); B41M 7/0081 (2013.01); C09D 11/037 (2013.01); C09D 11/322 (2013.01); C09D 11/52 (2013.01); H05K 1/0353 (2013.01); H05K 1/097 (2013.01); H05K 3/1283 (2013.01); C01P 2004/13 (2013.01); H05K 2201/0145 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0158 (2013.01); H05K 2201/0257 (2013.01); H05K 2201/026 (2013.01); H05K 2203/1131 (2013.01);
Abstract

A composite includes a plastic substrate and an electrical insulator layer formed on the plastic substrate. The electrical insulator layer contains boron nitride nanotubes (BNNTs), which may be unmodified or modified BNNTS. The composite is suitable for use in making printed electronic devices. A process includes providing a plastic substrate and forming on at least a portion of a surface of the plastic substrate a layer that contains the BNNTs. A metallic ink trace is formed on a portion of the layer, such that the metallic ink trace is spaced-apart from the substrate. Using photonic or thermal sintering techniques, the metallic ink trace is then sintered.


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