The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2024
Filed:
Jul. 06, 2022
Hyundai Motor Company, Seoul, KR;
Kia Corporation, Seoul, KR;
Lotte Chemical Corporation, Seoul, KR;
Jin Young Yoon, Gimpo-si, KR;
Hee Joon Lee, Seoul, KR;
Dong Eun Cha, Hwaseong-si, KR;
Sun Jun Kwon, Seoul, KR;
Chun Ho Park, Seoul, KR;
Seung Ryong Jeong, Seoul, KR;
Kyung Hwan Lim, Uiwang-si, KR;
Eun Hwa Jang, Uiwang-si, KR;
HYUNDAI MOTOR COMPANY, Seoul, KR;
KIA CORPORATION, Seoul, KR;
LOTTE CHEMICAL CORPORATION, Seoul, KR;
Abstract
The present disclosure provides a thermoplastic resin composition having high rigidity and a low coefficient of linear thermal expansion and a molded article including the same. Specifically, the thermoplastic resin composition includes a base resin including at least two polypropylene-based resins having different melt indexes, an elastomer having a melt index (190° C., 2.16 kg) of 20 g/10 min to 35 g/10 min as measured by ASTM D1238, and inorganic particles, and has a flexural modulus (FM) of 2,500 MPa or more and a coefficient of linear thermal expansion (CLTE) of 60 μm/m° C. or less.