The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2024
Filed:
Mar. 25, 2020
Applicant:
Toray Industries, Inc., Tokyo, JP;
Inventors:
Hideto Mitsuoka, Nagoya, JP;
Yuji Ozeki, Nagoya, JP;
Assignee:
Toray Industries, Inc., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 5/24 (2006.01); B29C 33/68 (2006.01); B29C 70/42 (2006.01); B29C 71/00 (2006.01); B29K 63/00 (2006.01); B29K 105/08 (2006.01); B29K 307/04 (2006.01); B32B 5/02 (2006.01); B32B 5/26 (2006.01); B32B 7/12 (2006.01); B32B 15/085 (2006.01); B32B 15/18 (2006.01); B32B 27/12 (2006.01); B32B 27/32 (2006.01); C08J 5/12 (2006.01);
U.S. Cl.
CPC ...
C08J 5/243 (2021.05); B29C 33/68 (2013.01); B29C 70/42 (2013.01); B29C 71/009 (2013.01); B32B 5/024 (2013.01); B32B 5/263 (2021.05); B32B 7/12 (2013.01); B32B 15/085 (2013.01); B32B 15/18 (2013.01); B32B 27/12 (2013.01); B32B 27/32 (2013.01); C08J 5/128 (2013.01); B29K 2063/00 (2013.01); B29K 2105/0881 (2013.01); B29K 2307/04 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/106 (2013.01); B32B 2307/538 (2013.01); B32B 2307/542 (2013.01); C08J 2323/12 (2013.01); C08J 2323/20 (2013.01); C08J 2463/00 (2013.01);
Abstract
A molded article of a carbon fiber composite material includes at least carbon fibers and a resin composition. The molded article of a carbon fiber composite material is characterized in that the surface roughness Ra thereof is 0.01-2 μm and in that the tensile shear adhesive strength (F0) thereof when a metal has been adhered to the surface thereof via an adhesive layer that contains an epoxy compound and is 0.1-3 mm thick is 10-40 MPa.