The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2024
Filed:
Jan. 14, 2022
Applicant:
Schott Ag, Mainz, DE;
Inventors:
Jens Ulrich Thomas, Mainz, DE;
Thomas Zetterer, Landshut, DE;
Antti Määttänen, Tampere, SE;
Robert Hettler, Kumhausen, DE;
Yutaka Onezawa, Otsu, JP;
Assignee:
Schott AG, Mainz, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0058 (2013.01); B81C 1/00333 (2013.01); B81C 2203/0118 (2013.01); B81C 2203/0163 (2013.01);
Abstract
A hermetically sealed package includes: a base substrate and a cover substrate which define at least part of the package, the base substrate and the cover substrate being hermetically sealed to one another by at least one laser bonding line, the at least one laser bonding line having a height perpendicular to its bonding plane, at least the cover substrate including a toughened layer at its surface, at least on a side opposite the at least one laser bonding line; and at least one functional area enclosed in the package.