The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 28, 2024

Filed:

Mar. 19, 2020
Applicant:

Dai Nippon Printing Co., Ltd., Tokyo, JP;

Inventors:

Ryo Fujii, Tokyo, JP;

Satoshi Furuta, Tokyo, JP;

Yoshiaki Netsu, Tokyo, JP;

Tomomi Nakajima, Tokyo, JP;

Yosuke Sumida, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/30 (2006.01); B32B 7/12 (2006.01); B32B 27/08 (2006.01); B32B 27/16 (2006.01); B32B 27/20 (2006.01); B32B 27/32 (2006.01);
U.S. Cl.
CPC ...
B32B 3/30 (2013.01); B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 27/16 (2013.01); B32B 27/20 (2013.01); B32B 27/32 (2013.01); B32B 2255/10 (2013.01); B32B 2255/26 (2013.01); B32B 2307/3065 (2013.01); B32B 2307/412 (2013.01); B32B 2451/00 (2013.01);
Abstract

The invention provides a transparent resin film that has a smooth surface on a side to be laminated on a substrate to prevent entering of air bubbles when bonded to a substrate and has a pattern of protrusions and depressions on a side opposite to the side to be laminated on a substrate to provide high design quality, a method for producing the transparent resin film, and a decorative material. The invention relates to a transparent resin film to be laminated on a substrate including a picture layer, the transparent resin film having a pattern of protrusions and depressions with a maximum height Rz of 20 μm or higher and 200 μm or lower on a side opposite to a side to be laminated on the substrate, the transparent resin film having a maximum height Rz of 20 μm or lower on the side to be laminated on the substrate.


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