The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2024
Filed:
May. 23, 2022
Seiko Epson Corporation, Tokyo, JP;
SEIKO EPSON CORPORATION, , JP;
Abstract
An injection molding apparatus includes a support that supports a molding die including an upper die and a lower die, and an injection unit that injects a molding material toward a cavity defined by the upper die and the lower die. In the state in which the molding die is supported by the support, the injection unit, the upper die, and the lower die are arranged sequentially from above in the vertical direction. The injection unit includes a rotating flat screw having a groove forming surface in which a groove is formed, a barrel having a flat screw facing surface facing the groove forming surface and having a communication hole into which the molding material flows, and a heater that heats a material supplied to the space between the groove forming surface and the flat screw facing surface, plasticizes at least part of the material through the rotation of the flat screw and the heat produced by the heater to produce the molding material, and delivers the molding material to the communication hole.