The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 28, 2024

Filed:

Nov. 15, 2019
Applicant:

Jsw Aktina System Co., Ltd., Yokohama, JP;

Inventors:

Kenichi Ohmori, Tokyo, JP;

Suk-Hwan Chung, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/067 (2006.01); B23K 26/06 (2014.01); B23K 26/0622 (2014.01); H01L 21/268 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
B23K 26/067 (2013.01); B23K 26/0604 (2013.01); B23K 26/0622 (2015.10); B23K 26/0643 (2013.01); H01L 21/268 (2013.01); B23K 2101/40 (2018.08);
Abstract

There are provided a laser irradiation apparatus, a laser irradiation method, and a semiconductor device manufacturing method that reduce irradiation unevenness of a laser beam. A laser irradiation apparatus includes a waveform shaping device (). The waveform shaping device () includes a laser beam source (), a first waveform shaping unit () that shapes the pulse waveform of a pulse laser beam by applying a delay according to an optical path length difference between two light beams (Land L) branched by a first beam splitter (), a wave plate that changes the polarization state of the pulse laser beam from the first waveform shaping unit (), and a second waveform shaping unit () that shapes the pulse waveform of the pulse laser beam by applying a delay according to an optical path length difference between two light beams (Land L) branched by a second beam splitter ().


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