The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2024
Filed:
Feb. 22, 2019
Corning Incorporated, Corning, NY (US);
Hasan Fiaz, Goleta, CA (US);
Jann Paul Kaminski, Santa Barbara, CA (US);
Raymond Miller Karam, Santa Barbara, CA (US);
Brian Nilsen, Goleta, CA (US);
Marie Bernadette O'Regan, Santa Barbara, CA (US);
Garrett Andrew Piech, Corning, NY (US);
Sergio Tsuda, Horseheads, NY (US);
ChuanChe Wang, Horseheads, NY (US);
Ming Ying, Santa Barbara, CA (US);
CORNING INCORPORATED, Corning, NY (US);
Abstract
A method of separating a portion of an object comprising: presenting an object having a thickness; using a laser emission at a wavelength to perforate at least a portion of the thickness of the object sequentially over a length to form a series of perforations between a first portion of the object on one side of the series of perforations and a second portion of the object on the other side of the series of perforations; and applying a stress to the object at the series of perforations to separate the first portion of the object from the second portion of the object, wherein the thickness of the object, at the series of perforations, is transparent to the wavelength of the laser emission.