The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2024

Filed:

Jul. 16, 2021
Applicant:

Samsung Display Co., Ltd., Yongin-si, KR;

Inventors:

Sang-Ho Moon, Cheonan-si, KR;

Chungi You, Asan-si, KR;

Taejong Eom, Cheonan-si, KR;

Assignee:

SAMSUNG DISPLAY CO., LTD., Yongin-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10K 59/131 (2023.01); G02F 1/01 (2006.01); G02F 1/1333 (2006.01); G02F 1/1339 (2006.01); G02F 1/1362 (2006.01); G02F 1/161 (2006.01); G02F 1/1679 (2019.01); H10K 50/84 (2023.01);
U.S. Cl.
CPC ...
H10K 59/131 (2023.02); G02F 1/0107 (2013.01); G02F 1/133388 (2021.01); G02F 1/1339 (2013.01); G02F 1/136286 (2013.01); G02F 1/13629 (2021.01); G02F 1/161 (2013.01); G02F 1/1679 (2019.01); H10K 50/841 (2023.02);
Abstract

A display device includes an array substrate including a pixel array disposed in a display area, an encapsulation substrate, and a sealing member disposed between the array substrate and the encapsulation substrate to combine the array substrate with the encapsulation substrate. The array substrate includes a signal transfer wing overlapping the sealing member and electrically connected to the pixel array, an insulation layer covering the signal transfer wiring and including an inorganic material, a power transfer wiring disposed on the insulation layer, overlapping the sealing member and having a multi-wiring structure, and an expansion pattern connected to the power transfer wiring, having a thickness smaller than an entire thickness of the power transfer wiring and overlapping the sealing member and the signal transfer wiring. An outer edge of the expansion pattern is disposed within a sealing area where the sealing member is disposed.


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