The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2024

Filed:

Jan. 26, 2023
Applicant:

Board of Regents, the University of Texas System, Austin, TX (US);

Inventors:

Romil Modi, Austin, TX (US);

Jonathan Reeder, Austin, TX (US);

Gregory T. Ellson, Dallas, TX (US);

Walter E. Voit, Austin, TX (US);

Alexandra Joshi Imre, Austin, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01); H05K 3/04 (2006.01); H05K 3/06 (2006.01); H05K 3/12 (2006.01); H05K 3/40 (2006.01); H01L 21/033 (2006.01); H05K 1/03 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4007 (2013.01); H05K 1/09 (2013.01); H05K 1/111 (2013.01); H05K 3/0041 (2013.01); H05K 3/048 (2013.01); H05K 3/064 (2013.01); H05K 3/067 (2013.01); H05K 3/1216 (2013.01); H05K 3/1225 (2013.01); H01L 21/0331 (2013.01); H05K 1/0393 (2013.01); H05K 3/1283 (2013.01); H05K 3/3463 (2013.01); H05K 2203/043 (2013.01); H05K 2203/087 (2013.01); H05K 2203/166 (2013.01);
Abstract

An electrical device, comprising a softening polymer layer, an electrode layer on a surface of the softening polymer layer and a cover polymer layer on the surface of the softening polymer layer. An opening in the polymer cover layer is filled with a reflowed solder, one end of the reflowed solder, located inside the opening, contacts a contact pad site portion of the electrode layer, and another end of the reflowed solder contacts an electrical connector electrode of the device.


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