The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2024
Filed:
Apr. 10, 2020
Applicant:
Dongwoo Fine-chem Co., Ltd., Iksan-si, KR;
Inventors:
Assignee:
DONGWOO FINE-CHEM CO., LTD., Iksan-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H01Q 1/24 (2006.01); H01Q 1/38 (2006.01); H01Q 1/48 (2006.01); H05K 1/02 (2006.01); H05K 1/16 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/28 (2006.01); H05K 3/36 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 1/118 (2013.01); H01Q 1/38 (2013.01); H05K 1/0218 (2013.01); H05K 1/189 (2013.01); H05K 3/281 (2013.01); H05K 2201/09327 (2013.01);
Abstract
A flexible printed circuit board includes a power wiring layer transmitting power and a signal wiring layer insulated and stacked over or under the power wiring layer. The flexible printed circuit board may also include an upper wiring layer and a lower wiring layer insulated and stacked each other, and the power wiring layer and the signal wiring layer are provided between the upper wiring layer and the lower wiring layer.