The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2024
Filed:
May. 28, 2021
San Fang Chemical Industry Co., Ltd., Kaohsiung, TW;
Chih-Yi Lin, Kaohsiung, TW;
Kuo-Kuang Cheng, Kaohsiung, TW;
Chi-Chin Chiang, Kaohsiung, TW;
Wen-Hsin Tai, Kaohsiung, TW;
I-Ju Wu, Kaohsiung, TW;
Chi-Ho Tien, Kaohsiung, TW;
SAN FANG CHEMICAL INDUSTRY CO., LTD., Kaohsiung, TW;
Abstract
The present disclosure is relates to a conductive film and a manufacturing method thereof. The conductive film includes a base layer, a TPU complex layer, a conductive layer and a TPU surface layer. The TPU complex layer includes a TPU heat-resistant layer and a TPU melting layer. The TPU heat-resistant layer is disposed on the TPU melting layer, and the TPU melting layer is disposed on the base layer. The conductive layer includes a conductive circuit disposed on the TPU heat-resistant layer. The TPU surface layer is disposed on the conductive layer. Utilizing the TPU complex layer, the conductive layer does not contact directly with the base layer to avoid breaking the conductive line of the conductive layer when the base layer is pulled. Therefore, the lifetime of the conductive film can be increased.