The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2024

Filed:

Jun. 16, 2023
Applicant:

Xmems Labs, Inc., Santa Clara, CA (US);

Inventors:

Chao-Yu Chen, Kaohsiung, TW;

Chiung C. Lo, San Jose, CA (US);

Jemm Yue Liang, Sunnyvale, CA (US);

Wen-Chien Chen, New Taipei, TW;

Jye Ren, Taipei, TW;

Assignee:

xMEMS Labs, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 1/28 (2006.01); H04R 1/10 (2006.01); H04R 1/24 (2006.01); H04R 19/02 (2006.01);
U.S. Cl.
CPC ...
H04R 1/2811 (2013.01); H04R 1/1016 (2013.01); H04R 1/24 (2013.01); H04R 19/02 (2013.01); H04R 2201/003 (2013.01);
Abstract

An acoustic device includes a first sound producing component and a back cavity structure. The first sound producing component has a first front side and a first back side, wherein the first sound producing component is a high frequency sound unit, and the first front side faces a sound propagating opening of the acoustic device. The back cavity structure is connected to the first back side of the first sound producing component. The first sound producing component produces a first acoustic wave from the first front side towards the sound propagating opening, and the first sound producing component produces a second acoustic wave from the first back side towards a back cavity of the back cavity structure. The back cavity structure is configured to flatten a peak or a dip of a frequency response of the first sound producing component.


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