The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2024

Filed:

Sep. 21, 2020
Applicant:

Lipac Co., Ltd., Seoul, KR;

Inventors:

Seong Wook Choi, Seoul, KR;

Young June Park, Seoul, KR;

Assignee:

LIPAC CO., LTD., Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 14/02 (2006.01); G02B 6/42 (2006.01); H04B 10/50 (2013.01); H04J 14/02 (2006.01); H04Q 11/00 (2006.01);
U.S. Cl.
CPC ...
H04B 10/501 (2013.01); G02B 6/4215 (2013.01); G02B 6/4228 (2013.01); H04J 14/02 (2013.01); H04Q 2011/0032 (2013.01);
Abstract

Provided are a subminiature optical transmission module and a method for manufacturing same. The optical transmission module includes: a mold body having a first surface and a second surface opposite to each other; multiple edge-type light emitting elements, each of which is molded inside the mold body by fitting same to the first surface so as to match with the first surface and generates an optical signal in the edge direction of a chip; and an optical component disposed on one side thereof so as to optically multiplex multiple optical signals incident from the multiple edge-type light emitting elements and to output same, wherein the identical height is configured between the surface of each light emitting element and the optical axis of the optical component, and the edge direction of the chip is parallel to the first surface of the mold body.


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