The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2024
Filed:
May. 10, 2022
Applicant:
Apple Inc., Cupertino, CA (US);
Inventors:
Sam Mahin Shirazi, San Jose, CA (US);
Eric T. Chiang, San Francisco, CA (US);
Matthew Burke, Ottawa, CA;
Tiexuan Wang, ShangHai, CN;
Yong Gang Li, Suzhou, CN;
Henry H. Yang, San Jose, CA (US);
Assignee:
Apple Inc., Cupertino, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/57 (2011.01); H01R 4/02 (2006.01); H01R 43/20 (2006.01); H01R 13/22 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01R 12/57 (2013.01); H01R 4/02 (2013.01); H01R 43/205 (2013.01); H01R 13/22 (2013.01); H05K 1/147 (2013.01); H05K 1/189 (2013.01); H05K 2201/056 (2013.01); H05K 2201/10128 (2013.01);
Abstract
Electronic assemblies and methods of attaching retention structures are described. The electronic assemblies may include a receiving substrate and a retention structure bonded to the receiving substrate. The retention structure may be patterned to include openings such as slot openings or a fishbone pattern in order to receive a pair of solder joints to bond the retention structure to a top side of the receiving substrate.