The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2024

Filed:

May. 31, 2022
Applicant:

Commissariat a L'energie Atomique ET Aux Energies Alternatives, Paris, FR;

Inventors:

Gabriel Pares, Grenoble, FR;

Antonio Clemente, Grenoble, FR;

Bruno Reig, Grenoble, FR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01Q 21/00 (2006.01); H01L 23/528 (2006.01); H01Q 1/24 (2006.01); H01Q 15/02 (2006.01); H01Q 21/06 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01Q 21/0025 (2013.01); H01L 23/5286 (2013.01); H01Q 1/24 (2013.01); H01Q 15/02 (2013.01); H01Q 21/0087 (2013.01); H01Q 21/065 (2013.01); H05K 1/0243 (2013.01); H05K 2201/10098 (2013.01);
Abstract

A stack for fabricating an integrated circuit intended to perform an electromagnetic-lens function for a reconfigurable transmitarray antenna, the stack including in succession: a substrate that includes a set of first active components configured to generate a phase shift, and that has first and second opposite surfaces, the first active components being integrated monolithically into the substrate; a metal layer, forming a ground plane on the first surface of the substrate; a layer of a cured polymer, formed on the metal layer; vias that are electrically insulated from the metal layer and that are arranged to electrically connect pairs of planar antennas, each electrically connected pair of planar antennas including first and second planar antennas that are aligned along the normal to the first and second surfaces of the substrate.


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