The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2024
Filed:
Jan. 25, 2021
Applicant:
Meridian Innovation Pte Ltd, Singapore, SG;
Inventors:
Wan Chia Ang, Singapore, SG;
Piotr Kropelnicki, Singapore, SG;
Ilker Ender Ocak, Singapore, SG;
Paul Simon Pontin, Singapore, SG;
Assignee:
Meridian Innovation Pte Ltd, Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01J 5/12 (2006.01); B81C 1/00 (2006.01); G01J 5/02 (2022.01); G01J 5/04 (2006.01); G01J 5/08 (2022.01); G01J 5/16 (2006.01); H01L 27/146 (2006.01); H01L 31/0224 (2006.01); H01L 31/09 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14669 (2013.01); B81C 1/00 (2013.01); B81C 1/00246 (2013.01); G01J 5/0225 (2013.01); G01J 5/024 (2013.01); G01J 5/046 (2013.01); G01J 5/048 (2013.01); G01J 5/0853 (2013.01); G01J 5/12 (2013.01); G01J 5/16 (2013.01); H01L 27/146 (2013.01); H01L 27/14612 (2013.01); H01L 27/14629 (2013.01); H01L 27/14643 (2013.01); H01L 27/14649 (2013.01); H01L 31/0224 (2013.01); H01L 31/09 (2013.01); B81C 2203/0742 (2013.01); G01J 2005/123 (2013.01);
Abstract
A complementary metal oxide semiconductor (CMOS) device embedded with micro-electro-mechanical system (MEMS) components in a MEMS region. The MEMS components, for example, are infrared (IR) thermoconforms. The device is encapsulated with a CMOS compatible IR transparent cap to hermetically seal the MEMS sensors in the MEMS region. The CMOS cap includes a base cap with release openings and a seal cap which seals the release openings.