The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2024

Filed:

Sep. 18, 2020
Applicant:

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Zhanfeng Cao, Beijing, CN;

Ke Wang, Beijing, CN;

Zhiwei Liang, Beijing, CN;

Jianguo Wang, Beijing, CN;

Guocai Zhang, Beijing, CN;

Xinhong Lu, Beijing, CN;

Qi Qi, Beijing, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); G02F 1/13357 (2006.01); H01L 25/075 (2006.01); H01L 27/15 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 27/124 (2013.01); G02F 1/133603 (2013.01); H01L 25/0753 (2013.01); H01L 27/127 (2013.01); H01L 27/156 (2013.01); H01L 33/62 (2013.01); H01L 2933/0066 (2013.01);
Abstract

The present disclosure provides an array substrate and a manufacturing method thereof, a display panel and a backlight module. The manufacturing method of the array substrate includes: providing a base substrate; forming a metal wiring layer on a side of the base substrate, the metal wiring layer including a first copper metal layer; forming a planarization layer on a side of the metal wiring layer away from the base substrate; forming a drive lead layer on a side of the planarization layer away from the base substrate, the drive lead layer being electrically connected to the metal wiring layer, the drive lead layer including a second copper metal layer with a thickness larger than that of the first copper metal layer; forming a functional device layer on a side of the drive lead layer away from the base substrate.


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