The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2024
Filed:
Jun. 10, 2021
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
A semiconductor package including a semiconductor chip; a lower redistribution layer on a lower surface of the semiconductor chip; a lower passivation layer on a lower surface of the lower redistribution layer; a UBM pad on the lower passivation layer and including an upper pad and a lower pad connected to the upper pad, the upper pad having a greater horizontal length at an upper surface thereof than a horizontal length at a lower surface thereof; a seed layer between the lower passivation layer and the UBM pad; and an external connecting terminal on a lower surface of the UBM pad, wherein the seed layer includes a first seed part covering a side surface of the upper pad, a second seed part covering a portion of the lower surface of the upper pad, and a third seed part covering a portion of a side surface of the lower pad.