The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2024
Filed:
Dec. 14, 2021
Korea Advanced Institute of Science and Technology, Daejeon, KR;
Keeyoung Son, Daejeon, KR;
Joung-Ho Kim, Daejeon, KR;
Subin Kim, Daejeon, KR;
Shinyoung Park, Daejeon, KR;
Seungtaek Jeong, Daejeon, KR;
Gapyeol Park, Daejeon, KR;
Boogyo Sim, Daejeon, KR;
Hyunwook Park, Daejeon, KR;
Taein Shin, Daejeon, KR;
Seongguk Kim, Daejeon, KR;
Kyungjune Son, Daejeon, KR;
Minsu Kim, Daejeon, KR;
Korea Advanced Institute Of Science And Technology, Daejeon, KR;
Abstract
A semiconductor package includes an interposer, an electronic device having a first side surface and a second side surface opposite to the first side surface, and including a plurality of memory dies stacked in a vertical direction, at least one first through pipe passing through the electronic device in the vertical direction adjacent to the first side surface, and moving a cooling liquid therein, and a plurality of thermal transmission lines extending in a horizontal direction inside the memory die, and extending in parallel from the first through pipe toward the second side surface.