The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2024
Filed:
Mar. 29, 2022
Applicant:
SK Hynix Inc., Icheon-si, KR;
Inventors:
In Su Park, Icheon-si, KR;
Jung Dal Choi, Icheon-si, KR;
Assignee:
SK hynix inc., Icheon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/71 (2006.01); H10B 43/27 (2023.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); H01L 21/71 (2013.01); H10B 43/27 (2023.02);
Abstract
There may be provided a method of manufacturing a semiconductor chip. A layer stack in which first material layers and second material layers are alternately stacked is formed on a semiconductor substrate that includes a chip region and a scribe lane region, and crack propagation guides are formed in a first portion of the layer stack within the scribe lane region.