The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2024

Filed:

Jan. 05, 2021
Applicant:

Kokusai Electric Corporation, Tokyo, JP;

Inventors:

Takashi Yahata, Toyama, JP;

Toshiyuki Kikuchi, Toyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/324 (2006.01); H01L 21/02 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/324 (2013.01); H01L 21/02057 (2013.01); H01L 21/02063 (2013.01); H01L 21/67115 (2013.01);
Abstract

Described herein is a technique capable of forming a film whose characteristics are uniform by discharging a residual component from a plurality of grooves before supplying a process gas. According to one aspect thereof, there is provided a substrate processing apparatus including: (a) loading a substrate on which a plurality of grooves are provided into a process chamber, wherein a residue is adhered to the plurality of the grooves; (b) desorbing the residue from the plurality of the grooves by heating the substrate; and (c) discharging the residue from the plurality of the grooves to a process space of the process chamber after (b) is performed by heating a surface of the substrate to a temperature higher than a temperature of the substrate in (b).


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