The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2024

Filed:

Mar. 14, 2023
Applicant:

Luvata Waterbury, Inc., Waterbury, CT (US);

Inventors:

Taeyoung Pyon, Waterbury, CT (US);

Antti Kilpinen, Turku, FI;

Assignee:

LUVATA WATERBURY, INC., Waterbury, CT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 12/10 (2006.01); H10N 60/01 (2023.01);
U.S. Cl.
CPC ...
H01B 12/10 (2013.01); H10N 60/0128 (2023.02); H10N 60/0184 (2023.02);
Abstract

A method for manufacturing a superconductor is described. A metal assembly precursor can be formed within a hollow copper support element. Forming the metal assembly precursor within a hollow copper support element by positioning a plurality of conductor elements about a core including Sn to provide a first plurality of inner interstitial spaces between the plurality of conductor elements between the core and conductor elements and a second plurality of outer interstitial spaces between the hollow copper support element and the core, the plurality of conductor elements including unreacted Nb. The metal assembly precursor can be reduced via cold drawing to produce a reduced metal assembly. The reduced metal assembly can be reaction heat treated so that the unreacted Nb undergoes a phase transformation to a reacted superconductor.


Find Patent Forward Citations

Loading…