The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2024

Filed:

Nov. 09, 2020
Applicants:

Daniel J Nawrocki, Chicopee, MA (US);

Yasumasa Akatsuka, Westborough, MA (US);

Katie Han, Westborough, MA (US);

Inventors:

Daniel J Nawrocki, Chicopee, MA (US);

Yasumasa Akatsuka, Westborough, MA (US);

Katie Han, Westborough, MA (US);

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03F 7/004 (2006.01); C08G 81/02 (2006.01); G03F 7/038 (2006.01); G03F 7/075 (2006.01); G03F 7/16 (2006.01); G03F 7/32 (2006.01); G03F 7/40 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0388 (2013.01); C08G 81/02 (2013.01); C08G 81/025 (2013.01); G03F 7/004 (2013.01); G03F 7/0045 (2013.01); G03F 7/0751 (2013.01); G03F 7/162 (2013.01); G03F 7/168 (2013.01); G03F 7/32 (2013.01); G03F 7/325 (2013.01); G03F 7/40 (2013.01);
Abstract

Disclosed and claimed herein are photoimageable dielectric compositions for dielectric passivation layers, dielectric protection layers as well as dielectric redistribution layers for use in the manufacture of semiconductors, semiconductor packages and circuit board constructions. More specifically it relates to photoimageable polymers containing vinyl groups capable of being crosslinked during processing and post cured at lower temperatures and shorter times than conventional dielectric materials. The processed compositions are characterized by low dielectric constants and low dissipation factors as well as low moisture uptake, chemical and thermal stability, flexibility and excellent HAST (Highly Accelerated Stress Test) and TCT (Thermal Cycling Test) results. The invention also relates to low dk/df dielectric compositions that are not photoimageable.


Find Patent Forward Citations

Loading…