The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2024

Filed:

Aug. 16, 2021
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Shawn Matthew Johnston, Rochester, MN (US);

Clinton William Erie, Adams, MN (US);

Ryan Paske, Oronoco, MN (US);

Steven Charles Erickson, Rochester, MN (US);

Michael John MacPherson, Elgin, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 25/18 (2006.01); F28D 15/00 (2006.01); F28D 21/00 (2006.01);
U.S. Cl.
CPC ...
G01N 25/18 (2013.01); F28D 15/00 (2013.01); F28D 2021/0029 (2013.01);
Abstract

An apparatus for thermal interface material detection includes a heat dissipating device stack up that includes a heat dissipating device, a thermal interface material, a heat generating component, and a printed circuit board. The heat dissipating device is disposed on the thermal interface material, the thermal interface material is disposed on the heat generating component, and the heat generating component is disposed on the printed circuit board. A channel in a body of the heat dissipating device includes an embedded conductive probe, where a first end of the embedded conductive probe leads to a lower surface of the body of the heat dissipating device and a second end of the embedded conductive probe leads to an upper surface of the body of the heat dissipating device.


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