The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2024

Filed:

Dec. 15, 2020
Applicant:

Mmi Semiconductor Co., Ltd., Tokyo, JP;

Inventors:

Takashi Kasai, Kyoto, JP;

Koji Momotani, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01F 1/688 (2006.01); G01F 1/684 (2006.01); G01F 1/696 (2006.01); H10N 10/851 (2023.01); G01F 1/692 (2006.01); G01F 15/04 (2006.01); G01J 5/12 (2006.01); G01K 7/02 (2021.01); G01P 5/10 (2006.01);
U.S. Cl.
CPC ...
G01F 1/6888 (2013.01); G01F 1/6845 (2013.01); G01F 1/696 (2013.01); H10N 10/851 (2023.02);
Abstract

A thermopile sensor includes a thermopile. The thermopile is formed by connecting thermocouples, in series on an insulating film, in which a first PolySi interconnect and a metal interconnect including a metal portion in at least a part thereof are connected, each of the thermocouples connected in series is arranged side by side with a predetermined gap, the metal interconnect is arranged to overlap the first PolySi interconnect in each of the thermocouples, at a connection portion between a thermocouple and an adjacent thermocouple, the metal interconnect crosses the gap between the first PolySi interconnects, and a first width of a portion of the gap where the metal interconnect crosses the gap between the first PolySi interconnects is greater than a second width of a remaining portion of the gap between the first PolySi interconnects.


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