The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2024
Filed:
Mar. 28, 2022
Massachusetts Institute of Technology, Cambridge, MA (US);
Purdue Research Foundation, West Lafayette, IN (US);
Evelyn N. Wang, Cambridge, MA (US);
Lin Zhao, Revere, MA (US);
Bikram Bhatia, Cambridge, MA (US);
Xiangyu Li, Cambridge, MA (US);
Arny Leroy, Montreal, CA;
Kyle Wilke, Boston, MA (US);
Lenan Zhang, Cambridge, MA (US);
Jeffrey Youngblood, Crawfordsville, IN (US);
Rodney Trice, Xenia, OH (US);
Chad T. Wilson, Cambridge, MA (US);
Olivia Brandt, West Lafayette, IN (US);
Rodrigo Orta Guerra, West Lafayette, IN (US);
Massachusetts Institute of Technology, Cambridge, MA (US);
Purdue Research Foundation, West Lafayette, IN (US);
Abstract
Devices and methods for fabrication of a multiscale porous high-temperature heat exchanger for high-temperature and high-pressure applications are disclosed. The heat exchanger can include a core with macrochannels formed in a checkerboard pattern to facilitate alternative flow of working fluid having hot and cold temperatures between adjacent macrochannels. Each macrochannel can include a two-dimensional microchannel array that further distributes flow throughout the heat exchanger to enhance heat transfer and mechanical strength without significant pressure drop penalty. The heat exchanger can further include a header integrated therewith to distribute working fluid flowing through the heat exchanger through the outlets such that it flows evenly therethrough. Methods of fabricating heat exchangers of this nature are also disclosed.