The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2024

Filed:

Jul. 17, 2020
Applicant:

Sanyo Special Steel Co., Ltd., Himeji, JP;

Inventors:

Tetsuji Kuse, Himeji, JP;

Yoshikazu Aikawa, Himeji, JP;

Yuichi Nagatomi, Himeji, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C 9/00 (2006.01); B22F 1/00 (2022.01); B22F 1/05 (2022.01); B22F 1/06 (2022.01); B22F 1/065 (2022.01); C22C 9/06 (2006.01);
U.S. Cl.
CPC ...
C22C 9/00 (2013.01); B22F 1/00 (2013.01); B22F 1/05 (2022.01); B22F 1/06 (2022.01); B22F 1/065 (2022.01); C22C 9/06 (2013.01); B22F 2301/10 (2013.01); B22F 2304/10 (2013.01);
Abstract

Provided is a Cu-based alloy powder that is suitable for a process involving rapid melting and rapid solidification and that can provide a shaped object superior in characteristics. The powder is composed of a Cu-based alloy, which contains an element M being one or more elements selected from Cr, Fe, Ni, Zr, and Nb: 0.1% by mass or more and 10.0% by mass or less, Si: more than 0% by mass and 0.20% by mass or less, P: more than 0% by mass and 0.10% by mass or less, and S: more than 0% by mass and 0.10% by mass or less, the balance being Cu and inevitable impurities. This powder has a ratio (D50/TD) of the average particle diameter D50 (μm) thereof to the tap density TD (Mg/m) is 0.2×10·m/Mg or more and 20×10·m/Mg or less, and has a sphericity of 0.80 or more and 0.95 or less.


Find Patent Forward Citations

Loading…