The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2024
Filed:
May. 20, 2021
Hangzhou First Applied Material Co., Ltd., Zhejiang, CN;
Haonan Wang, Zhejiang, CN;
Mingjie Cao, Zhejiang, CN;
Yan Sang, Zhejiang, CN;
Hongbing Hou, Zhejiang, CN;
Wei Deng, Zhejiang, CN;
Yunxiao Mei, Zhejiang, CN;
Dayue Jin, Zhejiang, CN;
Chufeng Yang, Zhejiang, CN;
HANGZHOU FIRST APPLIED MATERIAL CO., LTD., Zhejiang, CN;
Abstract
The present disclosure provides an anti-PID encapsulation adhesive film, a photovoltaic module, and a photovoltaic module manufacturing method. The anti-PID encapsulation adhesive film includes a base adhesive film layer, an insulating layer, and a conductive layer. The insulating layer is located on one side surface of the base adhesive film layer. The insulating layer has a grid structure. The grid structure includes grid lines and a plurality of hollow portions defined by the grid lines. The grid lines have a structure corresponding to gaps between cell pieces. The conductive layer includes a plurality of conductive portions. The conductive portions are arranged in the hollow portions in one-to-one correspondence. The volume resistivity of the conductive portions is less than 100 Ω·cm.