The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2024
Filed:
Nov. 06, 2018
Applicant:
Ihi Corporation, Koto-ku, JP;
Inventors:
Rie Harada, Tokyo, JP;
Yousuke Mizokami, Tokyo, JP;
Takahiko Shinohara, Tokyo, JP;
Shinji Muto, Tokyo, JP;
Assignee:
IHI Corporation, Koto-ku, JP;
Primary Examiner:
Int. Cl.
CPC ...
C04B 37/00 (2006.01); B23K 1/00 (2006.01); B23K 1/19 (2006.01); C04B 41/00 (2006.01); C04B 41/50 (2006.01); C04B 41/87 (2006.01); F01D 5/28 (2006.01); F02K 9/97 (2006.01);
U.S. Cl.
CPC ...
C04B 37/003 (2013.01); B23K 1/19 (2013.01); C04B 41/009 (2013.01); C04B 41/5059 (2013.01); C04B 41/87 (2013.01); F01D 5/282 (2013.01); F01D 5/284 (2013.01); F01D 5/288 (2013.01); F02K 9/97 (2013.01); B23K 1/00 (2013.01); C04B 37/006 (2013.01); C04B 2237/122 (2013.01); C04B 2237/128 (2013.01); C04B 2237/16 (2013.01); C04B 2237/36 (2013.01); C04B 2237/365 (2013.01); C04B 2237/38 (2013.01); C04B 2237/52 (2013.01); C04B 2237/555 (2013.01); C04B 2237/61 (2013.01); C04B 2237/708 (2013.01); F05D 2230/237 (2013.01); F05D 2230/90 (2013.01); F05D 2300/2261 (2013.01); F05D 2300/6033 (2013.01);
Abstract
A ceramic matrix composite component includes a first substrate and a second substrate each formed of a silicide-containing ceramic matrix composite, silicon carbide layers respectively coating a bonding surface of the first substrate and a bonding surface of the second substrate, and a bonding layer formed of a silicon-containing alloy and provided between the silicon carbide layer coating the bonding surface of the first substrate and the silicon carbide layer coating the bonding surface of the second substrate.