The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2024

Filed:

Sep. 23, 2021
Applicant:

Ihi Corporation, Tokyo, JP;

Inventors:

Koutarou Inose, Tokyo, JP;

Naoyuki Matsumoto, Tokyo, JP;

Daiki Okita, Tokyo, JP;

Kenshiro Kimura, Tokyo, JP;

Hiroto Yamaoka, Tokyo, JP;

Assignee:

IHI Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 37/12 (2006.01); B32B 38/00 (2006.01);
U.S. Cl.
CPC ...
B32B 37/1207 (2013.01); B32B 2038/0076 (2013.01);
Abstract

A metal-resin joining method of joining a metal member to a composite material member including a fiber reinforced plastic composite material includes an applying step of applying a first adhesive that is a thermosetting adhesive to a first region between the metal member and the composite material member, and applying a second adhesive that is a thermosetting adhesive to a second region between the metal member and the composite material member, a provisional bonding step of irradiating a first irradiation region of the metal member opposed to the first region with a laser light, and heating and curing the first adhesive to provisionally bond the metal member and the composite material member together, and a main bonding step of curing the second adhesive after the provisional bonding step to bond the metal member and the composite material member together.


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