The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2024

Filed:

Jul. 11, 2019
Applicant:

Essilor International, Charenton-le-Pont, FR;

Inventors:

Pascal Soave, Charenton-le-Pont, FR;

Michel Matz, Charenton-le-Pont, FR;

Carlos Gonzalez, Dallas, TX (US);

Assignee:

Essilor International, Charenton-le-Pont, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29D 11/00 (2006.01); B29C 70/78 (2006.01);
U.S. Cl.
CPC ...
B29D 11/00528 (2013.01); B29C 70/78 (2013.01); B29D 11/00413 (2013.01); B29D 11/00634 (2013.01); B29D 11/0073 (2013.01);
Abstract

A molding device for casting an optical article with a thermoset resin the optical article defining two opposed main surfaces, one of which being formed by an optical functional wafer, the molding device comprising: —a. a molding element () forming a rear or a front part of a casting mold —b. a gasket () intended to surround the molding element —c. an initially curved wafer () defining a predetermined curvature depending on one of the two main surfaces of the optical article to be molded —d. a closing element () defining in a closing position in which the peripheral part of the wafer on the gasket is pinched, a pouring space between the molding element, the gasket and the wafer —e. spacing means () interposed between the wafer and the molding element to define an internal volume between the wafer and the closing element, the spacing means, wafer and closing element being configured to form a set hermetic to the resin to be poured into the molding device the closing member occupies a closing position.


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