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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11986922 B1

PDFFull Text
Date of Patent:
May. 21, 2024

Filed:

Dec. 31, 2019

Techniques for combining cmp process tracking data with 3d printed cmp consumables

Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Jason G. Fung, Santa Clara, CA (US);

Rajeev Bajaj, Fremont, CA (US);

Daniel Redfield, Morgan Hill, CA (US);

Aniruddh Jagdish Khanna, Fremont, CA (US);

Mario Cornejo, San Jose, CA (US);

Gregory E. Menk, Pleasanton, CA (US);

John Watkins, Los Gatos, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:

Patterson + Sheridan, LLP

Primary Examiner:

Nicholas R Krasnow

Int. Cl.
CPC ...
B29C 64/00 (2017.01); B24B 37/26 (2012.01); B24B 49/00 (2012.01); B24B 49/10 (2006.01); B24B 49/14 (2006.01); B24B 49/16 (2006.01); B33Y 10/00 (2015.01); B33Y 80/00 (2015.01); H01L 21/306 (2006.01); H01L 21/66 (2006.01); H01L 21/67 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
B24B 37/26 (2013.01); B24B 49/003 (2013.01); B24B 49/10 (2013.01); B24B 49/14 (2013.01); B24B 49/16 (2013.01); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12); H01L 21/30625 (2013.01); H01L 21/67075 (2013.01); H01L 21/67253 (2013.01); H01L 21/67294 (2013.01); H01L 22/20 (2013.01); B29K 2995/0003 (2013.01); B29K 2995/0005 (2013.01); B29L 2031/736 (2013.01); H01L 22/12 (2013.01); H01L 22/26 (2013.01);
Abstract

Chemical mechanical polishing (CMP) apparatus and methods for manufacturing CMP apparatus are provided herein. CMP apparatus may include polishing pads, polishing head retaining rings, and polishing head membranes, among others, and the CMP apparatus may be manufactured via additive manufacturing processes, such as three dimensional (3D) printing processes. The CMP apparatus may include wireless communication apparatus components integrated therein. Methods of manufacturing CMP apparatus include 3D printing wireless communication apparatus into a polishing pad and printing a polishing pad with a recess configured to receive a preformed wireless communication apparatus.

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