The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2024

Filed:

Oct. 29, 2020
Applicants:

Ryan R. Dehoff, Knoxville, TN (US);

Hunter B. Henderson, Livermore, CA (US);

Scott Mccall, Livermore, CA (US);

Richard Michi, Knoxville, TN (US);

Peeyush Nandwana, Oak Ridge, TN (US);

Ryan Ott, Ames, IA (US);

Alexander J. Plotkowski, Knoxville, TN (US);

Orlando Rios, Knoxville, TN (US);

Amit Shyam, Knoxville, TN (US);

Zachary C. Sims, Knoxville, TN (US);

Kevin D. Sisco, Knoxville, TN (US);

David Weiss, Manitowoc, WI (US);

Ying Yang, Knoxville, TN (US);

Inventors:

Ryan R. Dehoff, Knoxville, TN (US);

Hunter B. Henderson, Livermore, CA (US);

Scott McCall, Livermore, CA (US);

Richard Michi, Knoxville, TN (US);

Peeyush Nandwana, Oak Ridge, TN (US);

Ryan Ott, Ames, IA (US);

Alexander J. Plotkowski, Knoxville, TN (US);

Orlando Rios, Knoxville, TN (US);

Amit Shyam, Knoxville, TN (US);

Zachary C. Sims, Knoxville, TN (US);

Kevin D. Sisco, Knoxville, TN (US);

David Weiss, Manitowoc, WI (US);

Ying Yang, Knoxville, TN (US);

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C 21/00 (2006.01); B23K 26/342 (2014.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01); B33Y 70/10 (2020.01); B22F 9/08 (2006.01); B23K 103/10 (2006.01);
U.S. Cl.
CPC ...
B23K 26/342 (2015.10); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); B33Y 70/10 (2020.01); C22C 21/00 (2013.01); B22F 2009/0824 (2013.01); B22F 2301/052 (2013.01); B22F 2304/10 (2013.01); B23K 2103/10 (2018.08);
Abstract

Disclosed herein are embodiments of an Al—Ce—Ni alloy for use in additive manufacturing. The disclosed alloy embodiments provide fabricated objects, such as bulk components, comprising a heterogeneous microstructure and having good mechanical properties even when exposed to conditions used during the additive manufacturing process. Methods for making and using alloy embodiments also are disclosed herein.


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