The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2024

Filed:

Nov. 06, 2020
Applicant:

Screen Holdings Co., Ltd., Kyoto, JP;

Inventors:

Yuji Tanaka, Kyoto, JP;

Masaya Asai, Kyoto, JP;

Masahiko Harumoto, Kyoto, JP;

Koji Kaneyama, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B05D 1/00 (2006.01); B05C 11/08 (2006.01); B05C 11/10 (2006.01); B05D 1/36 (2006.01); B05D 3/00 (2006.01); C23F 1/00 (2006.01); C23F 1/08 (2006.01); H01L 21/67 (2006.01); H01L 21/677 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
B05D 1/005 (2013.01); B05C 11/08 (2013.01); B05C 11/10 (2013.01); B05C 11/1039 (2013.01); B05D 1/36 (2013.01); B05D 3/007 (2013.01); C23F 1/00 (2013.01); C23F 1/08 (2013.01); H01L 21/67051 (2013.01); H01L 21/6708 (2013.01); H01L 21/67167 (2013.01); H01L 21/67173 (2013.01); H01L 21/67178 (2013.01); H01L 21/67742 (2013.01); H01L 21/68707 (2013.01);
Abstract

A coating liquid containing metal as a metal-containing coating liquid is supplied to a surface to be processed of a substrate by a coating processing unit, whereby a metal-containing coating film is formed on the surface to be processed. The substrate on which the metal-containing coating film has been formed is transported to a metal removal unit by a transport mechanism. A removal liquid for dissolving the metal is supplied to a peripheral portion of the substrate by the metal removal unit such that the metal-containing coating film remains in a region except for the peripheral portion of the surface to be processed of the substrate.


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