The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2024

Filed:

Jul. 20, 2018
Applicant:

Sharp Kabushiki Kaisha, Sakai, JP;

Inventors:

Takao Saitoh, Sakai, JP;

Masahiko Miwa, Sakai, JP;

Yohsuke Kanzaki, Sakai, JP;

Yi Sun, Sakai, JP;

Masaki Yamanaka, Sakai, JP;

Seiji Kaneko, Sakai, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10K 59/131 (2023.01); H10K 77/10 (2023.01); H01L 29/786 (2006.01); H10K 102/00 (2023.01);
U.S. Cl.
CPC ...
H10K 59/1315 (2023.02); H10K 77/111 (2023.02); H01L 29/78603 (2013.01); H01L 29/78633 (2013.01); H10K 2102/311 (2023.02);
Abstract

First overlying wires are provided between a display area and a bending portion, extending parallel to each other in a direction crossing the direction in which the bending portion extends. Underlying wires are provided between a first resin layer and a second resin layer on a resin substrate, extending across a slit and parallel to each other in a direction crossing the direction in which the bending portion extends. The first overlying wires are electrically connected respectively to the underlying wires via first contact holes formed through the second resin layer and inorganic insulation films.


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