The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 2024
Filed:
Aug. 30, 2021
Applicant:
Apple Inc., Cupertino, CA (US);
Inventors:
Herng-Jeng Jou, San Jose, CA (US);
Hoishun Li, San Jose, CA (US);
James A. Yurko, Saratoga, CA (US);
Assignee:
APPLE INC., Cupertino, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04M 1/02 (2006.01); B21D 22/02 (2006.01); H05K 5/02 (2006.01); C21D 7/06 (2006.01); C22F 1/00 (2006.01);
U.S. Cl.
CPC ...
H05K 5/0286 (2013.01); B21D 22/02 (2013.01); H04M 1/026 (2013.01);
Abstract
A component for an electronic device can include a metal injection molded (MIM) metallic body that at least partially defines an exterior surface. The metallic body can have an average porosity less than 1% in a first region that extends from the external surface to a depth of at least 100 microns below the external surface, and an average porosity greater than 1% in a second region adjacent to the first region.