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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11985757 B1

PDFFull Text
Date of Patent:
May. 14, 2024

Filed:

Jul. 09, 2021

Printed circuit board assembly

Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Won Wook So, Suwon-si, KR;

Doo Il Kim, Suwon-si, KR;

Young Sik Hur, Suwon-si, KR;

Assignee:

SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;

Attorney:

Morgan, Lewis & Bockius LLP

Primary Examiner:

Xiaoliang Chen

Int. Cl.
CPC ...
H05K 1/00 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/36 (2006.01); H01L 23/538 (2006.01); H01L 23/552 (2006.01); H01L 23/66 (2006.01); H01Q 1/38 (2006.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0203 (2013.01); H01L 23/3128 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01L 24/20 (2013.01); H01Q 1/38 (2013.01); H05K 1/0216 (2013.01); H05K 1/0277 (2013.01); H05K 1/144 (2013.01); H05K 1/181 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/214 (2013.01); H05K 2201/10356 (2013.01); H05K 2201/10378 (2013.01);
Abstract

A printed circuit board assembly includes a first printed circuit board, a second printed circuit board disposed on the first printed circuit board and including an antenna pattern, a third printed circuit board disposed on the first printed circuit board, one or more first electronic components disposed between the first and the second printed circuit board and electrically connected to at least one of the first and the second printed circuit board, one or more second electronic components disposed between the first and the third printed circuit board, and electrically connected to at least one of the first and the third printed circuit board, a first interposer substrate electrically connecting the first printed circuit board and the second printed circuit board to each other, and a second interposer substrate electrically connecting the first printed circuit board and the third printed circuit board to each other.

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