The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2024

Filed:

Oct. 25, 2019
Applicant:

Ningbo Sunny Opotech Co., Ltd., Zhejiang, CN;

Inventors:

Bojie Zhao, Zhejiang, CN;

Zhewen Mei, Zhejiang, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 23/57 (2023.01); H04N 23/55 (2023.01);
U.S. Cl.
CPC ...
H04N 23/57 (2023.01); H04N 23/55 (2023.01);
Abstract

A camera module includes optical lenses, a light filter, a circuit board, a photosensitive chip conductively connected to the circuit board, and a bonding portion. The bonding portion has a lower bonding side, a top bonding surface, and a light path. The lower bonding side of the bonding portion is bonded to a circuit board assembly, and the bonding portion surrounds a photosensitive area of the photosensitive chip, so that the photosensitive area of the photosensitive chip is exposed to the light path of the bonding portion. A periphery of the light filter is bonded to the top bonding surface of the bonding portion, so that the light filter is kept in the light path of the photosensitive chip by the bonding portion. The optical lenses are kept in the photosensitive path of the photosensitive chip, effectively reducing the height of the camera module.


Find Patent Forward Citations

Zhao, Bojie. (2024). Photosensitive assembly, camera module, method for manufacturing camera module, and electronic device (U.S. Patent No. 11985408). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11985408

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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