The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2024

Filed:

Nov. 24, 2021
Applicant:

Amphenol Commercial Products (Chengdu) Co., Ltd., Chengdu, CN;

Inventors:

Jun Fan, Chengdu, CN;

Tao Zeng, Chengdu, CN;

Ki Ka Lau, Kowloon, HK;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/72 (2011.01); H01R 12/70 (2011.01); H01R 13/6461 (2011.01); H01R 13/6581 (2011.01);
U.S. Cl.
CPC ...
H01R 12/721 (2013.01); H01R 12/7005 (2013.01); H01R 12/727 (2013.01); H01R 13/6461 (2013.01); H01R 13/6581 (2013.01);
Abstract

A card edge connector for providing high-speed interconnections between different printed circuit boards. The card edge connector may include a plurality of wafers, each having a plurality of conductors. The conductors may include tails at one end and mating contact portions at an opposing end. The connector may have more rows of tails than columns of mating contact portions, so that the tails extend less distance from an edge of a PCB toward its center. The connector may be formed from multiple wafers of different sizes. Shorter wafers may have mating contact portions in columns and tails in rows. Taller wafers may have mating contact portions in the same column as a respective shorter wafer and tails in a row parallel to and offset from the row of tails of the respective shorter wafer.


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