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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11984545 B1

PDFFull Text
Date of Patent:
May. 14, 2024

Filed:

Dec. 29, 2021

Method of manufacturing a light emitting device

Applicant:

Shenzhen Jufei Optoelectronics Co., Ltd., Shenzhen, CN;

Inventors:

Naoyuki Urasaki, Chikusei, JP;

Kanako Yuasa, Saitama, JP;

Assignee:

SHENZHEN JUFEI OPTOELECTRONICS CO., LTD., Shenzhen, CN;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Hoa B Trinh

Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/38 (2010.01); H01L 33/48 (2010.01); H01L 33/50 (2010.01); H01L 33/52 (2010.01); H01L 33/60 (2010.01); H01L 23/00 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/60 (2013.01); H01L 33/38 (2013.01); H01L 33/486 (2013.01); H01L 33/50 (2013.01); H01L 33/52 (2013.01); H01L 24/45 (2013.01); H01L 24/73 (2013.01); H01L 33/62 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/181 (2013.01); H01L 2924/1815 (2013.01);
Abstract

A method of manufacturing a light emitting device includes disposing at least one light emitting element on a recessed part of a resin package. The resin package having the recessed part includes a resin molding with a white pigment having a particle size from 0.1 μm to 50 μm and at least one lead electrode. The resin molding is disposed on a portion of a main face of the at least one lead electrode and is not in contact with a rear face of the at least one lead electrode. There is no gap at a joint face between the resin molding and the at least one lead electrode. The at least one light emitting element is disposed on the main face of the at least one lead electrode.

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