The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 2024
Filed:
Nov. 09, 2021
Applicant:
Stmicroelectronics (Grenoble 2) Sas, Grenoble, FR;
Inventor:
Jerome Lopez, Saint Jean de Moirans, FR;
Assignee:
STMicroelectronics (Grenoble 2) SAS, Grenoble, FR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 23/10 (2006.01); H01L 23/12 (2006.01); H01L 33/52 (2010.01); H01S 5/02218 (2021.01); H01S 5/068 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3114 (2013.01); H01L 23/10 (2013.01); H01L 23/12 (2013.01); H01L 33/52 (2013.01);
Abstract
An encapsulation hood is fastened onto electrically conductive zones of a support substrate using springs. Each spring has a region in contact with an electrically conductive path contained in the encapsulation hood and another region in contact with a corresponding one of the electrically conductive zones. The fastening of the part of the encapsulation hood onto the support substrate compresses the springs and further utilizes a bead of insulating glue located between the compressed springs.