The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2024

Filed:

Jun. 01, 2021
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Toru Tanaka, Kumamoto, JP;

Takashi Sato, Osaka, JP;

Hayato Kato, Kumamoto, JP;

Kazuhito Odane, Saga, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 5/12 (2006.01); B22F 3/00 (2021.01); B22F 3/11 (2006.01); H01G 9/00 (2006.01); H01G 9/052 (2006.01); H01G 13/00 (2013.01);
U.S. Cl.
CPC ...
H01G 9/0029 (2013.01); B22F 3/004 (2013.01); B22F 3/11 (2013.01); B22F 5/12 (2013.01); H01G 9/052 (2013.01); H01G 13/00 (2013.01);
Abstract

A mold includes a pair of first mold parts, a pair of second mold parts, and a pair of third mold parts that define six surfaces of a molded body substantially having a rectangular parallelepiped shape. At least one of the pair of third mold parts includes an upper mold part and a lower mold part. The upper mold part defines an upper space of a molding space, and the lower mold part defines a lower space of the molding space. The upper mold part and the lower mold part are individually slidable. The lower mold part protrudes toward the molding space with respect to the upper mold part so that a step portion is formed. The upper mold part is slidable in cooperation with the lower mold part in a state in which the step portion is formed or absent.


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