The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 2024
Filed:
Jul. 09, 2020
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Inventors:
Lee Francis, Milton Keynes, GB;
William Jarvis, Milton Keynes, GB;
Takayuki Tange, Milton Keynes, GB;
Assignee:
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 17/06 (2006.01); H01F 27/255 (2006.01); H01F 27/42 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2828 (2013.01); H01F 17/062 (2013.01); H01F 27/255 (2013.01); H01F 27/425 (2013.01);
Abstract
A magnetic-component module includes a substrate, a core on a first surface of the substrate, a spacer on the core, a winding including wire bonds extending over the core and electrically connecting a first portion of the substrate and a second portion of the substrate, and traces on and/or in the substrate, a lead frame that supports the core and that electrically connects the winding to the substrate, and an overmold material encapsulating the core, the spacer, the wire bonds, and a portion of the lead frame.