The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 2024
Filed:
Mar. 25, 2021
Applicant:
Denka Company Limited, Tokyo, JP;
Inventors:
Daisuke Goto, Tokyo, JP;
Hiroaki Ota, Tokyo, JP;
Assignee:
DENKA COMPANY LIMITED, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 19/02 (2006.01); B32B 3/30 (2006.01); B32B 7/08 (2019.01); B32B 7/12 (2006.01); B32B 15/01 (2006.01); B32B 15/04 (2006.01); B32B 18/00 (2006.01); G06K 19/06 (2006.01); H01L 23/498 (2006.01); H01L 23/544 (2006.01); H05K 1/02 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
G06K 19/02 (2013.01); B32B 3/30 (2013.01); B32B 15/016 (2013.01); B32B 15/043 (2013.01); G06K 19/06037 (2013.01); H01L 23/544 (2013.01); H05K 1/0269 (2013.01); H05K 7/205 (2013.01); B32B 7/08 (2013.01); B32B 7/12 (2013.01); B32B 18/00 (2013.01); B32B 2255/06 (2013.01); B32B 2255/205 (2013.01); B32B 2264/108 (2013.01); B32B 2307/302 (2013.01); B32B 2307/538 (2013.01); B32B 2457/08 (2013.01); H01L 23/49838 (2013.01); H01L 2223/54406 (2013.01); H01L 2223/54413 (2013.01); H05K 1/0204 (2013.01);
Abstract
A ceramic circuit board includes a ceramic base material, a metal layer (first metal layer), and a marker portion. The marker portion is formed on the surface of the first metal layer. The surface of the metal layer (first metal layer) may be plated. When the surface of the metal layer (first metal layer) is plated, the marker portion may be formed on the plating.