The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2024

Filed:

Mar. 16, 2021
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

David W. Lum, Cupertino, CA (US);

Kyung Wook Kim, Saratoga, CA (US);

Kwang Soon Park, San Ramon, CA (US);

Mingxia Gu, Campbell, CA (US);

Jun Qi, San Jose, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/1335 (2006.01); G02F 1/13357 (2006.01); G09G 3/34 (2006.01); H01L 25/16 (2023.01); H05B 47/105 (2020.01); H05B 47/16 (2020.01);
U.S. Cl.
CPC ...
G02F 1/133612 (2021.01); G02F 1/133601 (2021.01); G02F 1/133603 (2013.01); G02F 1/133605 (2013.01); G02F 1/133606 (2013.01); G02F 1/133628 (2021.01); G09G 3/3426 (2013.01); H01L 25/167 (2013.01); H05B 47/105 (2020.01); H05B 47/16 (2020.01); G09G 2320/0626 (2013.01);
Abstract

A pixel array may be illuminated with backlight illumination from a backlight. The backlight may include a two-dimensional array of light-emitting diodes, with each light-emitting diode being placed in a respective cell. Different light-emitting diodes may have unique brightness magnitudes based on the content of the given display frame. Driver integrated circuits may control one or more associated light-emitting diodes to have a desired brightness level. The driver integrated circuits may be formed in an active area of the backlight. The driver integrated circuits may be arranged in groups that are daisy chained together. A digital signal (that includes information such as addressing information) may be propagated through the group of driver integrated circuits. To manage thermal performance of the backlight, the backlight may include a thermally conductive layer and/or a heat sink structure. To increase the efficiency of the backlight, the backlight may include one or more reflective layers.


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